System for the heat treatment of substrates, and method for detecting measurement data in said system
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United States of America Patent
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Oct 11, 2016
Grant Date -
May 29, 2014
app pub date -
Jun 6, 2012
filing date -
Jun 6, 2011
priority date (Note) -
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Abstract
The present invention relates to a device (100) for the heat treatment of substrates and to a method for recording measurement data in said device, where said device (100) comprises at least one heatable chamber (102), a carrier system (108), a sensor assembly (112), and an actuator (111) that is independent of the carrier system (108). The carrier system (108) is designed to carry substrates, whereas the sensor assembly (112) is further configured for coupling to a data recording and/or data storage device (130). The actuator (111) is coupled to the sensor assembly (112) and is configured to position the sensor assembly (112) within the heatable chamber (102).
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