Capacitive pressure sensors for high temperature applications
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 11, 2016
Grant Date -
Oct 1, 2015
app pub date -
Feb 20, 2014
filing date -
Nov 15, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A capacitive pressure sensor includes a substrate wafer and a diaphragm wafer. The substrate wafer defines a substrate recess with a first recess. The diaphragm wafer defines a diaphragm recess with a second recess. The diaphragm wafer is bonded to the substrate wafer such that the substrate and diaphragm recesses form a height differentiated pressure chamber.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully