Bonding base for electronic components, and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 11, 2016
Grant Date -
Apr 12, 2012
app pub date -
May 14, 2010
filing date -
May 20, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A bonding base for electronic components, and a method. The bonding base comprises: a dielectric basic layer formed of a mixture comprising thermoplastic polymer, the polymer part of which mixture comprises 75 to 95% by weight of thermoplastic PPO, the polymer part further comprising 5 to 20% by weight of elastomer which is incompatible with PPO.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully