Spacer layer for embedding semiconductor die
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United States of America Patent
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Oct 4, 2016
Grant Date -
Jul 2, 2015
app pub date -
Dec 5, 2014
filing date -
Dec 30, 2013
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Abstract
A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.
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