Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the same
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United States of America Patent
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Oct 4, 2016
Grant Date -
Jul 9, 2015
app pub date -
Jan 5, 2015
filing date -
Jan 3, 2014
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Abstract
A method of manufacturing a semiconductor package substrate has a simplified process and an upper and lower pattern alignment problem is solved. A semiconductor package substrate is manufactured by the method. The method of manufacturing a semiconductor package substrate includes forming a first groove in one surface of a base substrate of a conductive material, filling the first groove with resin, and etching another surface of the base substrate to expose the resin filling the first groove.
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