Photosensitive epoxy resin composition, curable film for formation of optical waveguide core layer, and optical waveguide and optical/electrical transmission hybrid flexible printed wiring board produced by using the photosensitive epoxy resin composition or the curable film
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United States of America Patent
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Oct 4, 2016
Issued Date -
Mar 24, 2016
app pub date -
Mar 11, 2014
filing date -
Mar 11, 2014
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Abstract
The present invention provides a photosensitive epoxy resin composition which contains: (A) a cresol novolak polyfunctional epoxy resin; (B) a liquid epoxy resin having a fluorene skeleton in its main chain; and (C) a photoacid generator; wherein the components (A) and (B) are present in a mixing weight ratio of (A)/(B)=40/60 to 60/40. Where the inventive photosensitive epoxy resin composition is used as an optical waveguide forming material, particularly as an optical waveguide core layer forming material for formation of a core layer, the optical waveguide core layer can be formed as having excellent reflow resistance and a lower loss through a coating process and a roll-to-roll process without altering the conventional production process.
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