Aromatic polyamide films for transparent flexible substrates
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United States of America Patent
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Oct 4, 2016
Grant Date -
Sep 27, 2012
app pub date -
Jun 29, 2011
filing date -
Mar 23, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300 C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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