Methods and systems for use in grind shape control adaptation

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United States of America Patent

PATENT NO 9457446
APP PUB NO 20140134923A1
SERIAL NO

14042591

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Abstract

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A method of grinding wafers includes determining thickness variations in a wafer; determining incremental adjustments to spindle alignment based on best fit predictions of wafer shaper; and implemented the incremental adjustments to spindle alignment of a grind module.

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Patent Owner(s)

Patent OwnerAddress
REVASUM INC825 BUCKLEY ROAD SAN LUIS OBISPO CA 93401

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brake, Thomas E San Luis Obispo, US 2 24
Grant, David L Thousand Oaks, US 22 819
Kalenian, William J San Luis Obispo, US 11 151

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