Resin-sealed semiconductor device and method of manufacturing the same
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United States of America Patent
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Sep 27, 2016
Grant Date -
Dec 11, 2014
app pub date -
Apr 16, 2013
filing date -
May 8, 2012
priority date (Note) -
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Abstract
A resin-sealed semiconductor device includes a mesa-type semiconductor element which includes a mesa-type semiconductor base body having a pn junction exposure portion in an outer peripheral tapered region surrounding a mesa region, and a glass layer which covers at least the outer peripheral tapered region; and a molding resin which seals the mesa-type semiconductor element, wherein the glass layer is formed by forming a layer made of a predetermined glass composition for protecting a semiconductor junction which substantially contains no Pb such that the layer covers the outer peripheral tapered region and, subsequently, by baking the layer made of the glass composition for protecting a semiconductor junction.
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