Method and apparatus for mitigating parasitic coupling in a packaged integrated circuit

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United States of America Patent

PATENT NO 9455157
SERIAL NO

14846092

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Abstract

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A packaged IC has a package with a die paddle, a signal lead, and a ground lead. The packaged IC also has a die, secured to the package, with a ground pad and a signal pad. The signal pad is electrically connected to the signal lead, and the ground pad is electrically connected to both the die paddle and the ground lead.

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Patent Owner(s)

Patent OwnerAddress
ANOKIWAVE INC5355 MIRA SORRENTO PLACE SUITE 300 SAN DIEGO CA 92121

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Esmaili, Amir San Diego, US 2 14
Jain, Nitin San Diego, US 146 1999
Jain, Vipul Irvine, US 92 705
Kinayman, Noyan Harvard, US 15 526
Menon, Guarav San Marcos, US 1 2

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