Ceramic filled fluoropolymer compositions, methods and applications thereof
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United States of America Patent
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Sep 27, 2016
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Jun 12, 2014
app pub date -
Dec 12, 2013
filing date -
Dec 12, 2012
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Abstract
Circuits characterized by plural conductive paths supported on a non-conductive substrate are provided. Ceramic filler compositions and methods for preparing the ceramic filler compositions are also provided. Further, fluoropolymer-ceramic filler compositions and their laminates along with their respective methods for their preparation are provided. The fluoropolymer-ceramic filler compositions provide for excellent properties for dielectric constant, loss tangent and temperature coefficient of dielectric constant. In addition, electrical substrate materials having a conductive outer layer supported on a thin sheet of insulating material are also provided.
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