High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
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United States of America Patent
Stats
-
Sep 27, 2016
Grant Date -
Nov 3, 2011
app pub date -
Dec 25, 2009
filing date -
Jan 9, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In a high-strength and high-electrical conductivity copper alloy rolled sheet, 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn are contained, [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≦([Co]−0.007)/([P]−0.009)≦5.9, a total cold rolling ratio is equal to or greater than 70%, a recrystallization ratio is equal to or less than 45% a an average grain size of recrystallized grains is in the range of 0.7 to 7 μm, an average grain diameter of precipitates is in the range of 2.0 to 11 nm, and an average grain size of fine crystals is in the range of 0.3 to 4 μm. By the precipitates of Co and P, the solid solution of Sn, and fine crystals, the strength, conductivity and ductility of the copper alloy rolled sheet are improved.
First Claim
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International Classification(s)
- 2009 Application Filing Year
- H01B Class
- 1007 Applications Filed
- 533 Patents Issued To-Date
- 52.93 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 3 Citation Count
- H01B Class
- 19.83 % this patent is cited more than
- 9 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 27, 2028 |
