Device for aligning and pre-fixing a wafer
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United States of America Patent
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Sep 20, 2016
Grant Date -
Apr 2, 2015
app pub date -
Nov 10, 2014
filing date -
Apr 25, 2009
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Abstract
A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
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