Integrated passive and active seismic surveying using multiple arrays
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 20, 2016
Grant Date -
Aug 22, 2013
app pub date -
Feb 5, 2013
filing date -
Feb 6, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully