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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
UNIVERSITAET STUTTGART	KEPLERSTRASSE 7 STUTTGART 70174

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....

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• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Fruehauf, Norbert	Sindelfingen-Darmsheim, DE	8	23
Herrmann, Marcus	Neuffen, DE	17	74
Schalberger, Patrick	Magstadt, DE	6	5

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Mar 20, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 20, 2016	US,9446946,B2   US9446946B2	GRANTED PATENT AS SECOND PUBLICATION
April 21, 2016	US,20160107885,A1   US20160107885A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9446946

Method for the fabrication of thin-film transistors together with other components on a substrate

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