Methods and apparatuses for cutting of thin film solar cells
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United States of America Patent
Stats
-
Sep 20, 2016
Grant Date -
N/A
app pub date -
Aug 3, 2012
filing date -
Nov 9, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Methods and apparatuses for cutting thin film solar cells are provided. According to various implementations, the methods involve cutting a substrate having thin film solar cell materials deposited thereon by inducing a tear along the cutting line. Simultaneously with the tearing, the torn edges may be plastically deformed to produce a desired torn edge cross-sectional profile. Such a fracture may be induced by clamping regions of the substrate while simultaneously displacing the clamped regions relative to each other through the thickness of the substrate as the substrate is fed through the clamps providing the clamping. Apparatuses for cutting are also provided. According to various implementations, the apparatus may have cutter rollers and support rollers configured with an adjustable radial overlap.
First Claim
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International Classification(s)
- 2012 Application Filing Year
- B28B Class
- 297 Applications Filed
- 206 Patents Issued To-Date
- 69.37 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B28B Class
- 0 % this patent is cited more than
- 9 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 20, 2028 |