Solder alloy, solder paste, and electronic circuit board
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United States of America Patent
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Sep 13, 2016
Grant Date -
Oct 22, 2015
app pub date -
Jun 25, 2013
filing date -
Jul 19, 2012
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Abstract
A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.
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