Methods for performing embedded wafer-level packaging (eWLP) and eWLP devices, packages and assemblies made by the methods
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United States of America Patent
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Sep 13, 2016
Grant Date -
Sep 17, 2015
app pub date -
Jul 14, 2014
filing date -
Mar 14, 2014
priority date (Note) -
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Abstract
Embedded Wafer-Level Packaging (eWLP) methods and optoelectronic devices, packages and assemblies made by the eWLP methods are described. The eWLP methods allow electrical interconnections to be easily and economically made to the back sides of the chips of the eWLP wafer using eWLP wafer-level processes, thereby eliminating the need to use TMVs or TSVs to make such interconnections. The eWLP methods also allow thermal and optical interconnections between the back side and the front side of the eWLP wafer to be easily and economically made. In addition, the eWLP methods allow electrical and optical interfaces to be formed on the front side and/or on the back side of the eWLP wafer. The eWLP methods may be used to form a variety of very thin optoelectronic devices, packages and assemblies having a various useful configurations with high volume, yield and throughput.
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