Aqueous composition for etching of copper and copper alloys
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United States of America Patent
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Sep 13, 2016
Grant Date -
Oct 29, 2015
app pub date -
Jul 29, 2013
filing date -
Jan 15, 2013
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Abstract
The present invention relates to an aqueous composition for and a process for etching copper and copper alloys applying said aqueous composition. The aqueous composition comprises a source for Fe3+ ions, at least one acid, at least one triazole or tetrazole derivative, and at least one etching additive selected from N-alkylated iminodipropionic acid, salts thereof, modified polyglycol ethers and quaternary ureylene polymers. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like.
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