Electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 6, 2016
Grant Date -
N/A
app pub date -
May 28, 2015
filing date -
May 28, 2015
priority date (Note) -
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Abstract
An electronic component may include an integrated circuit device package and a second substrate. The integrated circuit device package may include a first substrate being bent or spread, a heat transfer member disposed in the first substrate, an integrated circuit device being bent or spread, a first pad disposed on one face of the integrated circuit device, and an adhesion member disposed between the integrated circuit device and the first substrate. The second substrate may be bent or spread. The second substrate may include a second pad. The integrated circuit device package may be combined with the second substrate by a thermo compression bonding process in which the heat transfer member may transfer a heat to the second substrate through the first substrate and the first pad may make contact with the second pad.
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