Method for manufacturing printed circuit board
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United States of America Patent
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Sep 6, 2016
Grant Date -
Mar 6, 2014
app pub date -
Jul 22, 2013
filing date -
Aug 29, 2012
priority date (Note) -
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Abstract
A printed circuit board includes a base, a number of conductive pads, a dielectric layer, an activated metal layer, a first metal seed layer, a second metal seed layer, and a plurality of metal bumps. The conductive pads are formed on the base. The dielectric layer is formed on a surface of the conductive pads and portions of the base are exposed from the conductive pads. The dielectric layer includes blind vias corresponding to the conductive pads, and a laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the dielectric layer. The second metal seed layer is formed on the activated metal layer and the conductive pads. Each metal bump is formed on the second metal seed layer, and each metal bump protrudes from the dielectric layer.
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