RFID integrated circuits with large contact pads

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United States of America Patent

PATENT NO 9436902
SERIAL NO

14451416

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Abstract

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An RFID IC assembly having a repassivation layer and a conductive redistribution layer may be assembled onto a tag substrate with an additional layer. The additional layer includes one or more etchants for creating an opening in a nonconductive barrier layer between the assembly and the substrate, and may also include an adhesive for attaching the assembly to the substrate.

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Patent Owner(s)

Patent OwnerAddress
IMPINJ INTERNATIONAL LTD701 N 34TH ST SUITE 300 SEATTLE WA 98103

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Diorio, Christopher J Shoreline, US 270 5595
Heinrich, Harley Snohomish, US 35 442
Koepp, Ronald Lee Snoqualmie, US 10 141
Mavoori, Jaideep Mercer Island, US 23 656
Oliver, Ronald A Seattle, US 104 2680
Wu, Tan Mau Seattle, US 26 275

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