High speed method for plating palladium and palladium alloys
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United States of America Patent
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Sep 6, 2016
Grant Date -
Oct 31, 2013
app pub date -
Jun 22, 2013
filing date -
Jul 20, 2007
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Abstract
A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
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