Heat-shrinking facility comprising a heating enclosure provided with a base and a hood
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Sep 6, 2016
Grant Date -
Jan 16, 2014
app pub date -
Jul 12, 2012
filing date -
Jul 12, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A facility for heat-shrinking sleeves made of heat-shrinkable material inserted onto supports, such as containers, includes an enclosure provided with a heat-diffusion means, a conveyor for carrying the supports through the enclosure between an intake of the enclosure and an output of the enclosure, the enclosure including a base and a hood which is mounted mobile between an open position allowing access to the conveyor and an operational position in which said hood is sealingly mounted on the base, the hood comprising two openings through which the conveyor extends when the hood is in operational position. The hood comprises an inner partition mounted mobile between a retracted position and a service position in which the partition defines with the side walls of the hood and the base a main chamber of the enclosure subjected to the action of the heat-diffusion means when the hood is in operational position.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SLEEVER INTERNATIONAL COMPANY | F-91420 MORANGIS |
International Classification(s)

- 2012 Application Filing Year
- B29C Class
- 3499 Applications Filed
- 2678 Patents Issued To-Date
- 76.54 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Fresnel, Eric | Paris, FR | 29 | 205 |
# of filed Patents : 29 Total Citations : 205 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- B29C Class
- 0 % this patent is cited more than
- 9 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 6, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

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Jun 05, 2018 | I | Issuance | |
May 16, 2018 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Jan 25, 2018 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TOREKI, WILLIAM;KANGA, RUSTOM S.;SIGNING DATES FROM 20130211 TO 20130219;REEL/FRAME:044729/0121 Owner name: QUICK-MED TECHNOLOGIES, INC., FLORIDA |
Jun 08, 2017 | P | Published | |
Jan 23, 2017 | F | Filing |

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