Electronic component, method for manufacturing the same and method for manufacturing multilayer printed wiring board
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United States of America Patent
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Aug 30, 2016
Grant Date -
Oct 23, 2014
app pub date -
Apr 23, 2014
filing date -
Apr 23, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component includes an insulation layer, an alignment mark positioned on a first surface of the insulation layer, and an adhesive layer including an optically opaque agent and formed on the first surface of the insulation layer or a second surface of the insulation layer on the opposite side with respect to the first surface of the insulation layer. The adhesive layer has an opening portion formed at the position corresponding to the alignment mark such that the opening portion exposes the alignment mark directly or through the insulation layer.
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