Wiring board and method for manufacturing the same
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United States of America Patent
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Aug 30, 2016
Grant Date -
Dec 11, 2014
app pub date -
Jun 3, 2014
filing date -
Jun 5, 2013
priority date (Note) -
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Abstract
A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and form a distance between adjacent first and third mounting pads which is greater than a distance between adjacent first mounting pads.
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