Wire bond through-via structure and method
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United States of America Patent
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Aug 30, 2016
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N/A
app pub date -
Aug 15, 2011
filing date -
Sep 17, 2010
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Abstract
A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer.
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