Heat dissipating device
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United States of America Patent
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Aug 30, 2016
Grant Date -
Jun 20, 2013
app pub date -
Mar 22, 2012
filing date -
Dec 18, 2011
priority date (Note) -
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Abstract
A heat dissipating device includes a base and a plurality of heat dissipating fins. The base includes a substrate and a box, wherein the substrate and the box are formed integrally and the box has an accommodating space therein. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.
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