LED device, method of manufacturing the same, and light-emitting apparatus

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United States of America Patent

PATENT NO 9425372
APP PUB NO 20120292660A1
SERIAL NO

13521294

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Abstract

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The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact.

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Patent Owner(s)

Patent OwnerAddress
JAPAN AVIATION ELECTRONICS INDUSTRY LIMITED21-1 DOGENZAKA 1-CHOME SHIBUYA-KU TOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kanno, Hideyuki Tokyo, JP 38 346

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