Wiring board and method for manufacturing the same
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United States of America Patent
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Aug 23, 2016
Grant Date -
Dec 11, 2014
app pub date -
Jun 3, 2014
filing date -
Jun 5, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and including a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and are set off from the second mounting pads toward the semiconductor element.
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