Package structures including discrete antennas assembled on a device
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United States of America Patent
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Aug 16, 2016
Grant Date -
Feb 11, 2016
app pub date -
Oct 20, 2015
filing date -
Dec 20, 2012
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Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.
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