Method for processing substrate and method for fabricating apparatus

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Aug 16, 2016
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Jan 2, 2014
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Mar 21, 2013
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May 29, 2006

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Abstract

A method for processing a substrate, the substrate comprising an organic film pattern, the method comprising: a fusion/deformation step of fusing said organic film pattern to deform the fused organic film pattern and a third removal step of removing at least a part of the fused and deformed organic film pattern.

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GOLD CHARM LIMITED	OFFSHORE CHAMBERS P O BOX 217 APIA

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Inventor Name	Address	# of filed Patents	Total Citations
Kido, Shusaku	Kanagawa, JP	49	780

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Method for processing substrate and method for fabricating apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

13848058

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PATENT NO	9419105
APP PUB NO	20140004667A1
SERIAL NO	13848058
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 16, 2016	US,9419105,B2 US9419105B2	GRANTED PATENT AS SECOND PUBLICATION
January 02, 2014	US,20140004667,A1 US20140004667A1	FIRST PUBLISHED PATENT APPLICATION

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13848058

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