Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects
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United States of America Patent
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Aug 16, 2016
Grant Date -
Dec 5, 2013
app pub date -
Aug 8, 2013
filing date -
Sep 4, 2008
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Abstract
An apparatus including a bond head, a supplemental support, a reduction module, and a transducer is provided. The bond head holds a first substrate that contains a first set of metal pads. The supplemental support holds a second substrate that contains a second set of metal pads. The aligner forms an aligned set of metal pads by aligning the first substrate to the second substrate. The reduction module contains the aligned substrates and a reduction gas flows into the reduction module. The transducer provides repeated relative motion to the aligned set of metal pads.
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