Integrated circuit (IC) package with thick die pad functioning as a heat sink
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United States of America Patent
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Aug 16, 2016
Grant Date -
Jul 7, 2016
app pub date -
Jan 5, 2015
filing date -
Jan 5, 2015
priority date (Note) -
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Abstract
An integrated circuit (IC) package includes a die pad and an IC die secured on the die pad. The IC die had outer edges aligned with outer edges of the die pad. An encapsulating material body surrounds the die pad and IC die. Leads extend outwardly from the encapsulating material body and are coupled to the IC die. Each lead has an upper surface coplanar with an upper surface of the IC die. The die pad has a lower surface exposed through the encapsulating material body, and has a thickness greater than a thickness of each of the plurality of leads.
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