Integrated circuit with on-die decoupling capacitors
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United States of America Patent
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Aug 16, 2016
Grant Date -
Feb 25, 2016
app pub date -
Aug 24, 2014
filing date -
Aug 24, 2014
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Abstract
A semiconductor device has an on-die decoupling capacitor that is shared between alternative high-speed interfaces. A capacitance pad is connected to the decoupling capacitor and internal connection pads are connected respectively to the alternative interfaces. Internal connection bond wires connect the decoupling capacitor to the selected interface through the capacitance pad and the internal connection pads in the same process as connecting the die to external electrical contacts of the device.
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