GLASS CAP WIREBOND PROTECTION FOR IMAGING TILES IN AN X OR GAMMA RAY INDIRECT IMAGING DETECTOR
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United States of America Patent
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Aug 16, 2016
Grant Date -
Aug 25, 2016
app pub date -
Feb 25, 2015
filing date -
Feb 25, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
Wirebond protection is provided for imaging tiles in which the imaging sensor and PCB are mounted side-by-side on a tile carrier for use in X or Gamma Ray indirect imaging detectors without use of a “glob top” encapsulant. A glass cap comprising a bead of adhesive material and a lid is formed to provide an enclosed open-air cavity around the wire bonds. As such, any expansion of the bead material does not produce mechanical stress on the wire bonds.
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