Chemical mechanical polishing conditioner with high quality abrasive particles
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 16, 2016
Grant Date -
Jul 23, 2015
app pub date -
Dec 17, 2014
filing date -
Jan 20, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to a chemical mechanical polishing conditioner with high quality abrasive particles, comprising a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles placed on the bonding layer, and the abrasive particles are placed on the substrate by the bonding layer; wherein the abrasive particles have a risk diamond content measured by a screening apparatus for screening abrasive particles. Therefore, the chemical mechanical polishing conditioner with high quality abrasive particles is produced, after the risk diamond content is judged by the screening apparatus for screening abrasive particles; thereby avoiding scratches and breakages produced on the polishing pad due to the risk diamonds during a chemical mechanical polishing process.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully