Camera module, method of assembly and imaging device
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United States of America Patent
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Aug 9, 2016
Grant Date -
Oct 17, 2013
app pub date -
Apr 12, 2013
filing date -
Apr 17, 2012
priority date (Note) -
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Abstract
A camera module has a lens module mounted on a substrate. The image sensor is located in a cavity in the substrate and is connected to the substrate by a bridge member, the infra-red filter. The image sensor is attached to the infra-red filter by a ring of adhesive surrounding the imaging area of the image sensor. The adhesive attaching the image sensor to the infra-red filter comprises spacers. The infra-red filter is attached to the substrate by adhesive. The cavity may extend through the substrate. The image sensor is further connected to the substrate by a sheet member, which may be made of metal. The sheet member is affixed to the bottom of the substrate and covers the hole in the substrate formed by the extension of the cavity through the substrate. A method of assembly of the camera module includes: providing a substrate with a cavity; locating the image sensor in the cavity; connecting the infra-red filter to the image sensor and the substrate; and mounting the lens module on the substrate.
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