Method for producing a hard material layer on a substrate, hard material layer and cutting tool

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United States of America Patent

PATENT NO 9409784
SERIAL NO

14381275

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Abstract

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A process for producing a hard material layer on a substrate includes depositing a TiCNB hard material layer by chemical vapor deposition (CVD) from a gas system including a titanium source, a boron source, at least one nitrogen source and at least one carbon source, in which the carbon source includes an alkane having at least two carbon atoms, an alkene or an alkyne. A cutting tool includes a substrate to which a TiCNB hard material layer has been applied, in which a ratio of carbon atoms (C) to nitrogen atoms (N) in the TiCxNyB1-x-y system deposited on the substrate is 0.70≦X≦1.0, preferably 0.75≦X≦0.85, and a polished section through the substrate and the hard material layer is substantially free of an eta phase following Murakami etching.

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Patent Owner(s)

Patent OwnerAddress
CERATIZIT AUSTRIA GMBH6600 REUTTE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Czettl, Christoph Poels, AT 5 0

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