MEMS package structure and manufacturing method thereof
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United States of America Patent
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Aug 9, 2016
Grant Date -
Oct 8, 2015
app pub date -
Jun 18, 2015
filing date -
Jan 29, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.
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