Heat dissipating high power systems
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United States of America Patent
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Aug 2, 2016
Grant Date -
Apr 23, 2015
app pub date -
Jan 5, 2015
filing date -
Mar 11, 2011
priority date (Note) -
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Abstract
An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components.
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