Stack memory
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United States of America Patent
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Aug 2, 2016
Grant Date -
May 12, 2016
app pub date -
May 12, 2014
filing date -
May 15, 2013
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Abstract
A semiconductor memory is formed by stacking a plurality of substrates and memory cells on each substrate are connected by data dump lines. A switch may intervene between the memory cell and the data dump line. When data of each substrate is dumped by the data dump line, a problem of decrease in a speed and an increase in power consumption due to a parasitic component can be minimized. Further, a core circuit including the memory cell may be disposed on one substrate and a peripheral circuit unit may be disposed on the remaining substrates.
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