Method for fabricating multiple transistor devices on a substrate with varying threshold voltages

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United States of America Patent

PATENT NO 9406567
SERIAL NO

13407527

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Abstract

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Fabrication of a first device on a substrate is performed by exposing a first device region, removing a portion of the substrate to create a trench in the first device region, forming a screen layer with a first dopant concentration in the trench on the substrate, and forming an epitaxial channel on the screen layer having a first thickness. On or more other devices are similarly formed on the substrate independent of each other with epitaxial channels of different thicknesses than the first thickness. Devices with screen layers having the same dopant concentration but with different epitaxial channel thicknesses have different threshold voltages. Thus, a wide variety of threshold voltage devices can be formed on the same substrate. Further threshold voltage setting can be achieved through variations in the dopant concentration of the screen layers.

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Patent Owner(s)

Patent OwnerAddress
MIE FUJITSU SEMICONDUCTOR LIMITED2000 MIZONO TADO-CHO KUWANA MIE 511-0118

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoffmann, Thomas San Jose, US 144 1468
Ranade, Pushkar Los Gatos, US 126 1886
Shifren, Lucian San Jose, US 139 2262
Thompson, Scott E Gainesville, US 64 1047

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