Facility and method for treating substrate

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United States of America Patent

PATENT NO 9405194
APP PUB NO 20140152966A1
SERIAL NO

14091764

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Abstract

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Provided is a method of a substrate treatment. The method includes providing an operation module with substrates contained in a lot and performing an operation treatment thereon and performing a test treatment on the substrates completed with the operation treatment in a test module. The performing of the test treatment includes determining a substrate to be tested, which is provided to the test module, to allow the test treatment to be completed within an operation treatment time for the substrates in a unit lot.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTD77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, Soo Min Cheonan-si, KR 10 27
Kang, Ho Shin Cheonan-si, KR 2 11
Kim, Dong Ho Cheonan-si, KR 120 523
Kim, Won Jin Cheonan-si, KR 45 124

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