Image sensor modules including primary high-resolution and secondary imagers
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United States of America Patent
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Aug 2, 2016
Grant Date -
Mar 3, 2016
app pub date -
Aug 19, 2015
filing date -
Aug 29, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An optoelectronic module includes one or more image sensors including photosensitive regions. The module includes a first imager including a first stack of beam shaping elements disposed over the image sensor(s) to direct incoming light to a first photosensitive region, and a second imager including a second stack of beam shaping elements disposed over the image sensor(s) to direct incoming light to a second photosensitive region. Each particular stack includes a respective high-dispersion beam shaping element, where the high-dispersion beam shaping element of the first stack forms part of an achromatic doublet at an object side of the first stack. The high-dispersion beam shaping element in the second stack is part of a laterally contiguous array of beam shaping elements that does not include the high-dispersion beam shaping element that forms part of the achromatic doublet at the object side of the first stack.
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Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 2, 2028 |
