Method and device for transferring a chip to a contact substrate
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United States of America Patent
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Jul 26, 2016
Grant Date -
Sep 4, 2008
app pub date -
Apr 10, 2006
filing date -
Apr 8, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A method and device for transferring a chip (18) situated on a transfer substrate (26) to a contact substrate (50), and for contacting the chip with the contact substrate, in which the chip, the back side (19) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts (59, 60) thereof that are arranged opposite a contact surface (58) of the contact substrate are brought into contact with substrate contacts (56, 57) arranged on the contact surface by means of a pressing device (45, 46) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.
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