Substrate processing with reduced warpage and/or controlled strain
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 26, 2016
Issued Date -
N/A
app pub date -
Jun 7, 2013
filing date -
May 12, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided are systems and methods for processing the surface of substrates that scan a laser beam at one or more selected orientation angles. The orientation angle or angles may be selected to reduce substrate warpage. When the substrates are semiconductor wafers having microelectronic devices, the orientation angles may be selected to produce controlled strain and to improve electronic performance of the devices.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully