Methods and systems for utilizing design data in combination with inspection data
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United States of America Patent
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Jul 26, 2016
Grant Date -
Jun 4, 2015
app pub date -
Dec 19, 2014
filing date -
Nov 18, 2005
priority date (Note) -
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Abstract
Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.
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