Vinylbenzyl-etherified-DOPO compound resin composition and preparation and application thereof
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United States of America Patent
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Jul 26, 2016
Grant Date -
Jun 18, 2015
app pub date -
Oct 22, 2014
filing date -
Dec 17, 2013
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Abstract
The present invention belongs to the technical field of a resin having low dielectric properties, and presents a vinylbenzyl-etherified-DOPO compound resin composition and a preparation method and application thereof. The composition includes a vinylbenzyl-etherified-DOPO compound resin and a vinyl-terminated polyphenylene ether resin. The DOPO resin is vinylbenzyl etherified in the present invention, thus obtaining a vinylbenzyl-etherified-DOPO compound resin having low dielectric properties, and there are no hydroxyl group on itself, no hydroxyl function group will be generated during the cross-linking reaction; and the vinylbenzyl-etherified-DOPO compound resin contains phosphorus atoms, and has flame retardancy. The prepared vinylbenzyl-etherified-DOPO compound resin and the hydroxyl-free, low dielectric vinyl-terminated polyphenylene ether resin are combined in the present invention, thus obtaining a resin composition having low dielectric constant and low dielectric loss tangent, which can achieve excellent dielectric properties and flame retardancy when applying to the metal laminates and printed circuit boards.
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