Ultrasonic joining method and ultrasonic joining device

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United States of America Patent

PATENT NO 9399330
APP PUB NO 20150165718A1
SERIAL NO

14561456

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Abstract

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An ultrasonic joining method for connecting paper material (5), in particular paper, board or paperboard, comprising the following steps: introducing the paper material (5) into a gap (4) between a sonotrode (2) and an anvil (3), causing the sonotrode (2) to oscillate ultrasonically for the ultrasonic welding of the paper material (5), the paper material (5) being moistened with demineralized water (9), preferably on inner sides of joining points, before and/or during the ultrasonic welding.

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Patent Owner(s)

Patent OwnerAddress
SYNTEGON TECHNOLOGY GMBHSTUTTGARTER STRASSE 130 WAIBLINGEN 71332

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wieduwilt, Ulrich Schwaebisch Gmuend, DE 29 107

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